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APPLIED MATERIALS (AMAT) P5000 ETCH
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.
    Documents
    verified-listing-icon

    Verified

    CATEGORY
    Dry / Plasma Etch

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    101544


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) P5000 ETCH

    APPLIED MATERIALS (AMAT)

    P5000 ETCH

    Dry / Plasma Etch
    Vintage: 1996Condition: Used
    Last VerifiedOver 60 days ago

    APPLIED MATERIALS (AMAT)

    P5000 ETCH

    verified-listing-icon
    Verified
    CATEGORY
    Dry / Plasma Etch
    Last Verified: Over 60 days ago
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    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    101544


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.
    Documents
    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) P5000 ETCH

    APPLIED MATERIALS (AMAT)

    P5000 ETCH

    Dry / Plasma EtchVintage: 1996Condition: UsedLast Verified:Over 60 days ago
    APPLIED MATERIALS (AMAT) P5000 ETCH

    APPLIED MATERIALS (AMAT)

    P5000 ETCH

    Dry / Plasma EtchVintage: 0Condition: UsedLast Verified:Over 60 days ago
    APPLIED MATERIALS (AMAT) P5000 ETCH

    APPLIED MATERIALS (AMAT)

    P5000 ETCH

    Dry / Plasma EtchVintage: 1995Condition: UsedLast Verified:Over 60 days ago