Description
Bonding Machine Chip Bonder, a high-precision multi-chip bonding system in fully functional condition. This integrated dispensing system supports multiple dispensing methods and epoxy resin processing. Maximum production efficiency reaches 7,000 wafers/hour, with flip chip bonding efficiency up to 2,500 wafers/hour. X/Y-axis positioning accuracy: ±7μm; θ-axis positioning accuracy: ±0.15°. An ideal choice for semiconductor chip packaging production. Supports multiple wafer handling methods, suitable for 2-inch to 12-inch wafers. Includes original computer and keyboard with a clear, intuitive operating interface.Configuration
No ConfigurationOEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.Documents
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Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 11 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
140560
Wafer Sizes:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
2200 EVO
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 11 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
140560
Wafer Sizes:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm, 12"/300mm
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Bonding Machine Chip Bonder, a high-precision multi-chip bonding system in fully functional condition. This integrated dispensing system supports multiple dispensing methods and epoxy resin processing. Maximum production efficiency reaches 7,000 wafers/hour, with flip chip bonding efficiency up to 2,500 wafers/hour. X/Y-axis positioning accuracy: ±7μm; θ-axis positioning accuracy: ±0.15°. An ideal choice for semiconductor chip packaging production. Supports multiple wafer handling methods, suitable for 2-inch to 12-inch wafers. Includes original computer and keyboard with a clear, intuitive operating interface.Configuration
No ConfigurationOEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.Documents
No documents