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Description
No missing partsConfiguration
Specifications: -X/Y placement accuracy: ± 8 µm @ 3 sigma -Bond force: 200 - 5,000g (50 - 5,000g option) -Die size: 0.3 - 20mm (Fast CUC mode <11mm only) -Die thickness: 50µm - 3mm, thinner on request -Wafer size: 4" - 12" (on 8" or 12" wafer frames) -Substrate types: FR4, ceramic, BGA, strip, flex, boat, leadframe -Working range: 13" x 8" -Flux film thickness: Various cavity plates available -Size: 1,600 mm x 1,200 mm x 1,540mm (W x D x H) -Weight: 2,000 kg -UPH: up to 8,800 (application dependant) -Vision system: 4MP, 12 x 12mm FOV Options: Substrate / Strip Handling • Input/output buffer • Magazine loader/unloader ML1 Vision system: • RGB lighting • OCR recognition for substrates Software: • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142) • Pseudo X-Ray • Flip and P&P Tool Inspection • Needle Hole Inspection • Eject Tool Needle Inspection • Eject Tool Cap Inspection • Ejection System Live Cam • SECS GEM Parameter Provider • Wafermap Verification by Border Component • Configure User Level • Advanced Flux Imprint Check • Chipping Inspection • Auto Illumination • Distributed Bonding • Single Component Tracking • Lot Management • Complete bonding • Custom slow travel speed/distance • Measure component spacing • Measuring component bench • Fluxlevel detection Component presentation: • Wafer stretcher (for 8" or 12" frames) • Various stretch adapters (for metal and plastic frames) • Wafer table rotation Component handling system: • Upgraded ionizers for TS-input-area and Eject-area) • Low bondforce kit (0.5 - 50N) • Pneumatic terminal Others: • External vacuum pump • Uninterruptable power supply • ALPS Host computerOEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.Documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
102801
Wafer Sizes:
Unknown
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
2200 EVO
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
102801
Wafer Sizes:
Unknown
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No missing partsConfiguration
Specifications: -X/Y placement accuracy: ± 8 µm @ 3 sigma -Bond force: 200 - 5,000g (50 - 5,000g option) -Die size: 0.3 - 20mm (Fast CUC mode <11mm only) -Die thickness: 50µm - 3mm, thinner on request -Wafer size: 4" - 12" (on 8" or 12" wafer frames) -Substrate types: FR4, ceramic, BGA, strip, flex, boat, leadframe -Working range: 13" x 8" -Flux film thickness: Various cavity plates available -Size: 1,600 mm x 1,200 mm x 1,540mm (W x D x H) -Weight: 2,000 kg -UPH: up to 8,800 (application dependant) -Vision system: 4MP, 12 x 12mm FOV Options: Substrate / Strip Handling • Input/output buffer • Magazine loader/unloader ML1 Vision system: • RGB lighting • OCR recognition for substrates Software: • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142) • Pseudo X-Ray • Flip and P&P Tool Inspection • Needle Hole Inspection • Eject Tool Needle Inspection • Eject Tool Cap Inspection • Ejection System Live Cam • SECS GEM Parameter Provider • Wafermap Verification by Border Component • Configure User Level • Advanced Flux Imprint Check • Chipping Inspection • Auto Illumination • Distributed Bonding • Single Component Tracking • Lot Management • Complete bonding • Custom slow travel speed/distance • Measure component spacing • Measuring component bench • Fluxlevel detection Component presentation: • Wafer stretcher (for 8" or 12" frames) • Various stretch adapters (for metal and plastic frames) • Wafer table rotation Component handling system: • Upgraded ionizers for TS-input-area and Eject-area) • Low bondforce kit (0.5 - 50N) • Pneumatic terminal Others: • External vacuum pump • Uninterruptable power supply • ALPS Host computerOEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.Documents
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