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BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
  • BESI / DATACON 2200 EVO
Description
No description
Configuration
No Configuration
OEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.
Documents

No documents

PREFERRED
 
SELLER
CATEGORY
Die Bonders / Sorters / Attachers

Last Verified: Over 60 days ago

Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

80339


Wafer Sizes:

Unknown


Vintage:

2012


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
 
SELLER

BESI / DATACON

2200 EVO

verified-listing-icon
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
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Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

80339


Wafer Sizes:

Unknown


Vintage:

2012


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.
Documents

No documents

Similar Listings
View All