Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon

2200 EVO

Overview

The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.

Active Listings

18

Services

Inspection, Insurance, Appraisal, Logistics

Have one like this?
List it with Moov and find the perfect buyer in no time at all.