Description
TFM_TiN-HM DepConfiguration
TFM_TiN-HM DepOEM Model Description
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.Documents
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LAM RESEARCH / NOVELLUS
INOVA NExT
Verified
CATEGORY
Deposition
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
49104
Wafer Sizes:
12"/300mm
Vintage:
2013
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LAM RESEARCH / NOVELLUS
INOVA NExT
Verified
CATEGORY
Deposition
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
49104
Wafer Sizes:
12"/300mm
Vintage:
2013
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
TFM_TiN-HM DepConfiguration
TFM_TiN-HM DepOEM Model Description
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.Documents
No documents