The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.

Lam Research is a leading supplier of plasma etch- and single-wafer clean equipment that plays a pivotal role in defining the features and capabilities of next-generation semiconductor devices. With the addition of Novellus' innovative thin-film deposition and surface preparation product lines, the new Lam Research is well-positioned within the industry to support critical technology transitions including 3D structures in advanced logic and NAND memory, as well as the scaling to 450 mm wafers.

LAM RESEARCH / NOVELLUS

INOVA

ULVAC

ENTRON EX

ENTRON-EX W300

The INOVA xT is a 300mm version of INOVA with proven HCM extendability to the 0.10-micron technology node. It has an industry-leading throughput of 100 wafers per hour (wph).

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INOVA

ENTRON EX

ENTRON-EX W300

INOVA xT