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KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
Description
One 300mm load port and 200mm load port
Configuration
No Configuration
OEM Model Description
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
Documents

No documents

CATEGORY
Defect Inspection

Last Verified: 16 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

119549


Wafer Sizes:

8"/200mm, 12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

SURFSCAN SP2

verified-listing-icon
Verified
CATEGORY
Defect Inspection
Last Verified: 16 days ago
listing-photo-0c4a3228bab3457caaf8a5c87ef9ca50-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

119549


Wafer Sizes:

8"/200mm, 12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
One 300mm load port and 200mm load port
Configuration
No Configuration
OEM Model Description
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
Documents

No documents