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KLA AIT II
  • KLA AIT II
  • KLA AIT II
  • KLA AIT II
Description
Defect Detection Machine
Configuration
No Configuration
OEM Model Description
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.
Documents

No documents

KLA

AIT II

verified-listing-icon

Verified

CATEGORY
Defect Inspection

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

115036


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

AIT II

verified-listing-icon
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
listing-photo-0b196db9cc1f4f3583872c59babeca83-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

115036


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Defect Detection Machine
Configuration
No Configuration
OEM Model Description
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.
Documents

No documents