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KLA AIT I
    Description
    Patterned Surface Inspection System
    Configuration
    Auto - Model: AIT I Main System - KLA-Tencor AIT I Mainframe - Currently Configured for 6"/150mm & 8"/200mm Wafers - Double Darkfield Inspection Tool - SECS II/GEM Communication Interface - Low Contact Chuck (AIT I) - Multi Channel Collection Optics System with Independent Programmable Spatial Filters - Pentium CPU with Windows NT Installed - Wafer Transfer Area Housing Cover - Wafer Handling Module - High Voltage Electronics - Front and Rear EMO’s with Covers - Flat Panel Display for AIT - Fold Down Keyboard Tray with Built In Mouse - X/Y Drive/Controller Chassis and Motion Controller Card - Blower Box (exhaust hoses not included) - Operations Manual and Documentation
    OEM Model Description
    The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.
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    KLA

    AIT I

    verified-listing-icon

    Verified

    CATEGORY

    Defect Inspection
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    60830


    Wafer Sizes:

    6"/150mm, 8"/200mm


    Vintage:

    1997

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    listing-photo-1b550ff0d4b649a4b1c15de499e5ed5c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49849/1b550ff0d4b649a4b1c15de499e5ed5c/4f62775531994c9a8510895e3fd57a4a_89d08eb88537413cb8eec3f1509f51151201a_mw.jpeg
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    listing-photo-1b550ff0d4b649a4b1c15de499e5ed5c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49849/1b550ff0d4b649a4b1c15de499e5ed5c/405c52f09d674ff3a4a7af5a2a739a48_1c366513536f4af58e6e419919c76225_mw.jpeg
    listing-photo-1b550ff0d4b649a4b1c15de499e5ed5c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49849/1b550ff0d4b649a4b1c15de499e5ed5c/ef8fcc11b5ac4a988c87056575ce14df_8799da5bb9e04af2b0bd8ec227f0d5d9_mw.jpeg
    listing-photo-1b550ff0d4b649a4b1c15de499e5ed5c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49849/1b550ff0d4b649a4b1c15de499e5ed5c/7159f69eb9864c7cb7700e988ae25494_fea74698c8f144ca9ae4e4317f7d8b7b_mw.jpeg
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    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    60830


    Wafer Sizes:

    6"/150mm, 8"/200mm


    Vintage:

    1997


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Patterned Surface Inspection System
    Configuration
    Auto - Model: AIT I Main System - KLA-Tencor AIT I Mainframe - Currently Configured for 6"/150mm & 8"/200mm Wafers - Double Darkfield Inspection Tool - SECS II/GEM Communication Interface - Low Contact Chuck (AIT I) - Multi Channel Collection Optics System with Independent Programmable Spatial Filters - Pentium CPU with Windows NT Installed - Wafer Transfer Area Housing Cover - Wafer Handling Module - High Voltage Electronics - Front and Rear EMO’s with Covers - Flat Panel Display for AIT - Fold Down Keyboard Tray with Built In Mouse - X/Y Drive/Controller Chassis and Motion Controller Card - Blower Box (exhaust hoses not included) - Operations Manual and Documentation
    OEM Model Description
    The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.
    Documents

    No documents

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