Description
Deposition systemConfiguration
System configuration: Dual loadlock, DLCM Hi/Lo transfer chamber, and triple SPEED process system Process modules: (Qty 3) SPEED modules consisting of PM2 (left), PM3 (center), and PM4 (right) Process-module manufacturing type: SSEMVIIT Product family: SPEED Product type: SPEED Product selection: Triple system Wafer substrate: Silicon Wafer flat type: Semi-notched Primary application: USG IMD Primary process: USG IMD Secondary process: USG - STI / PMD / ILD Improved uniformity 3” injection: Yes Software version: SPEED NEXT 5.502 B22 Country model requirements: Standard model System - DLCM and wafer handling: DLCM manufacturing type: SSEMVIIT Wafer cassette manufacturer: Entegris Wafer cassette model: FA200-85MT-7902 Front-end option: SMIF ready User interface: Cleanroom, right side Paddle and arc kits: Standard Cool station: MPS multi-PEC station Particle-check option: Particle sensor manifold Active wafer centering: Yes Manometers: Heated Pressure control: MKS MPD configuration: Triple FIF tool kit and template: AWC Teach System - Process and RF: MFC type: Celerity GF125 Foreline: Non-heated PM exhaust: Bottom Loadlock particle-sensor manifold: No, without HYT port LF generator: AE 5000 HF generator: Used RFG5500 LF match: Automatch RPC: None Dome heat exchanger: No Manifold B clean: Yes Endpoint kit: Endpoint Wafer-temperature monitoring: Passive temperature control System - Facilities and controls: Facilities kits: Bottom Cable length: 75 ft UPS readiness: No Declaration of Conformity: Yes Light tower: 3-light RYG Light-tower mounting: Staff mount TM cover: Standard cover Included tool kits and templates: Temperature calibration kit ATP2300 pump maintenance kit Mylar floor templateOEM Model Description
The Concept Two SPEED is a Novellus product that is designed for 200 mm wafers. It features a hemispherical source that is patented and delivers high throughput and manufacturability. The hemispherical source has a single excitation frequency and coil, which makes it simpler and more elegant than other systems that require multiple coils to approach the ion uniformity level of SPEED. The Concept Two SPEED is an HDP CVD system with three chambers that can accommodate the high pumping speeds required to operate at the mTorr pressures necessary for these CVD processes .Documents
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CATEGORY
CVD
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
148913
Wafer Sizes:
8"/200mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2" SPEED
CATEGORY
CVD
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
148913
Wafer Sizes:
8"/200mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Deposition systemConfiguration
System configuration: Dual loadlock, DLCM Hi/Lo transfer chamber, and triple SPEED process system Process modules: (Qty 3) SPEED modules consisting of PM2 (left), PM3 (center), and PM4 (right) Process-module manufacturing type: SSEMVIIT Product family: SPEED Product type: SPEED Product selection: Triple system Wafer substrate: Silicon Wafer flat type: Semi-notched Primary application: USG IMD Primary process: USG IMD Secondary process: USG - STI / PMD / ILD Improved uniformity 3” injection: Yes Software version: SPEED NEXT 5.502 B22 Country model requirements: Standard model System - DLCM and wafer handling: DLCM manufacturing type: SSEMVIIT Wafer cassette manufacturer: Entegris Wafer cassette model: FA200-85MT-7902 Front-end option: SMIF ready User interface: Cleanroom, right side Paddle and arc kits: Standard Cool station: MPS multi-PEC station Particle-check option: Particle sensor manifold Active wafer centering: Yes Manometers: Heated Pressure control: MKS MPD configuration: Triple FIF tool kit and template: AWC Teach System - Process and RF: MFC type: Celerity GF125 Foreline: Non-heated PM exhaust: Bottom Loadlock particle-sensor manifold: No, without HYT port LF generator: AE 5000 HF generator: Used RFG5500 LF match: Automatch RPC: None Dome heat exchanger: No Manifold B clean: Yes Endpoint kit: Endpoint Wafer-temperature monitoring: Passive temperature control System - Facilities and controls: Facilities kits: Bottom Cable length: 75 ft UPS readiness: No Declaration of Conformity: Yes Light tower: 3-light RYG Light-tower mounting: Staff mount TM cover: Standard cover Included tool kits and templates: Temperature calibration kit ATP2300 pump maintenance kit Mylar floor templateOEM Model Description
The Concept Two SPEED is a Novellus product that is designed for 200 mm wafers. It features a hemispherical source that is patented and delivers high throughput and manufacturability. The hemispherical source has a single excitation frequency and coil, which makes it simpler and more elegant than other systems that require multiple coils to approach the ion uniformity level of SPEED. The Concept Two SPEED is an HDP CVD system with three chambers that can accommodate the high pumping speeds required to operate at the mTorr pressures necessary for these CVD processes .Documents
No documents