Description
Clean System: : RF clean Sub-System Configuration: Remote AC rack RF Generator : ENI-12B (13.56Mhz) RF-Generator Rack : Chiller Model :AMAT-0 x1 .Configuration
Currently Configured for 200mm wafer sizes (Photo below) Install Type: DSM chamber General Information: System Platform: P5000 Wafer Size: 200mm Wafer Shape: Lamp heated EMO Type: Turn to Release CE Safety Mark: English Chamber Configuration: Chamber A: DSM chamber Chamber B: DSM chamber Chamber C: DSM chamber Chamber D: N/A Electrical Configuration: (Photo below) Line Voltage: 208V Full Load Current: 240 A Frequency: 50/60Hz Load lock Configuration: Load lock Type: 8 slots Cassette Type: 200mm Mainframe Configuration: 8 slots stage L/L NH3 : 1SLM SiH4 : 300 sccm N2 : 3SLM C3F8 : 300 sccm N2O : 2SLM N2 : 3SLMOEM Model Description
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.Documents
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CATEGORY
CVD
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147156
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
P5000 CVD
CATEGORY
CVD
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147156
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Clean System: : RF clean Sub-System Configuration: Remote AC rack RF Generator : ENI-12B (13.56Mhz) RF-Generator Rack : Chiller Model :AMAT-0 x1 .Configuration
Currently Configured for 200mm wafer sizes (Photo below) Install Type: DSM chamber General Information: System Platform: P5000 Wafer Size: 200mm Wafer Shape: Lamp heated EMO Type: Turn to Release CE Safety Mark: English Chamber Configuration: Chamber A: DSM chamber Chamber B: DSM chamber Chamber C: DSM chamber Chamber D: N/A Electrical Configuration: (Photo below) Line Voltage: 208V Full Load Current: 240 A Frequency: 50/60Hz Load lock Configuration: Load lock Type: 8 slots Cassette Type: 200mm Mainframe Configuration: 8 slots stage L/L NH3 : 1SLM SiH4 : 300 sccm N2 : 3SLM C3F8 : 300 sccm N2O : 2SLM N2 : 3SLMOEM Model Description
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.Documents
No documents