Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The AMAT CENTURA AP ULTIMA X is a high-density plasma chemical vapor deposition (CVD) system designed for semiconductor manufacturing in both 200mm and 300mm configurations. As an industry-leading workhorse, it excels in delivering high-quality dielectric films and void-free gap fill, crucial for advanced chip fabrication. The system's dual RF coils provide superior gap-fill capability across the wafer, while its innovative electrostatic chuck ensures excellent film quality and uniformity. Combined with remote plasma clean technology, it achieves exceptional defect control and improved mean-wafer-between-clean performance. The Ultima HDP system's advanced technology enables deposition of both undoped and doped films, catering to various applications such as shallow trench isolation (STI), pre-metal dielectric (PMD), interlayer dielectric (ILD), inter-metal dielectric (IMD), and passivation. Its versatility also extends to etchback and high-density plasma treatments, enhancing film quality in semiconductor manufacturing processes.Documents
No documents
APPLIED MATERIALS (AMAT)
Centura AP Ultima X
Verified
CATEGORY
CVD
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75590
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
Centura AP Ultima X
Verified
CATEGORY
CVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75590
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The AMAT CENTURA AP ULTIMA X is a high-density plasma chemical vapor deposition (CVD) system designed for semiconductor manufacturing in both 200mm and 300mm configurations. As an industry-leading workhorse, it excels in delivering high-quality dielectric films and void-free gap fill, crucial for advanced chip fabrication. The system's dual RF coils provide superior gap-fill capability across the wafer, while its innovative electrostatic chuck ensures excellent film quality and uniformity. Combined with remote plasma clean technology, it achieves exceptional defect control and improved mean-wafer-between-clean performance. The Ultima HDP system's advanced technology enables deposition of both undoped and doped films, catering to various applications such as shallow trench isolation (STI), pre-metal dielectric (PMD), interlayer dielectric (ILD), inter-metal dielectric (IMD), and passivation. Its versatility also extends to etchback and high-density plasma treatments, enhancing film quality in semiconductor manufacturing processes.Documents
No documents