Description
Package GrinderConfiguration
No ConfigurationOEM Model Description
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.Documents
No documents
DISCO
DFS8960
Verified
CATEGORY
CMP
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111735
Wafer Sizes:
Unknown
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFS8960
CATEGORY
CMP
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111735
Wafer Sizes:
Unknown
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Package GrinderConfiguration
No ConfigurationOEM Model Description
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.Documents
No documents