Description
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SUSS MICROTEC ABC200 AUTOMATED PRODUCTION WAFER BONDING SYSTEMOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents
SUSS MicroTec / KARL SUSS
ABC200
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69471
Wafer Sizes:
8"/200mm
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
ABC200
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69471
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
SUSS MICROTEC ABC200 AUTOMATED PRODUCTION WAFER BONDING SYSTEMOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents