SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

SUSS MicroTec / KARL SUSS

Wafer Bonding + Bond Alignment + Cleaning +  Metal Oxide Removal + Plasma Activation
Up to 200 mm 

ABC200

Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation
Up to 200 mm 

CBC200

ELP300

CB200M

Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy

FC-150

The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C.

SB6e

FC-250

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB8 Gen2 - from pieces up to 200mm wafers.

SB8 Gen2

Semi-automated system up to 300 mm
Mechanical Debonding 

DB12T

The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.

SB8e

XBC300

It is a high force bonder, from 10 gram-force up to 400 kilogram-force depending on the head configuration. This device bonder can operate as a "classic" one but also with a confinement chamber, using an acid gas mixture and/or reduced pressure. This permits much better quality of bonding process, resulting in good electrical conductivity and high mechanical resistance for more reliable components. Substrate size can be up to 300mm wafer.

FC-300

SB150

Universal Temporary Wafer Bonder for High Volume Manufacturing
SUSS MicroTec‘s XBS300 platform for temporary bonding represents the next generation of high-volume manufacturing temporary bonder solutions. The 200/300mm wafer bonding platform can be configured for a low cost of ownership and maximum process flexibility.

XBS300

SB8L

Debonder & Cleaner
The XBC300 Gen2 debonder and cleaner platform is designed for processing wafers of 200 and 300 mm in size as well as oversized carriers. Sophisticated processing allows for handling of tape mounted device wafer as thin as 50 µm or even below. Its advanced process versatility reaches from mechanical peel-off and excimer laser-assisted debonding to cleaning capabilities for thinned wafer and carrier wafer. Hereby the XBC300 Gen2 offers a comprehensive solution for 2.5D and 3D integration applications. The SUSS XBC300 Gen2 Debonder and Cleaner platform is designed for process development as well as high volume manufacturing. It offers both, low cost of ownership and process flexibility with full automation.

XBC300 Gen2

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB6 Gen2 - from pieces up to 150mm wafers.

SB6 Gen2

Automated system up to 300 mm (Excimer Laser) 
Alignment + Ablation + Laser-Assisted  Debonding + Laser Seed Layer  Removal

ELP300 Gen2

SB200

The LD12 debond module supplements the SUSS MicroTec product portfolio for laser-based wafer processing. It is based on the application of an excimer laser which uses nanosecond, high energy 308 nm laser pulses to break the chemical bonds in a release layer or the actual adhesive which holds the glass carrier to the device wafer. This excimer laser based debonding process does not produce significant thermal stress and therefore ensures the integrity of sensitive components. The LD12 module is designed to debond glass carriers from full thickness wafers or thinned 200 mm and 300mm wafers which are mounted on tape frames.
Using the LD12 enables high throughput debonding for applications in 2.5D and 3D integration, 3D MEMS and CIS, as well as in the field of power devices to be carried out quickly and carefully.

LD12

Permanent Wafer Bonding Platform for R&D and High-Volume Production
The universal XBS300 platform is designed for (hybrid) fusion bonding of aligned 200 mm and 300 mm wafers. Its highly modular design offers maximum configuration flexibility at low cost-of-ownership for customers. Different configurations are available to meet the requirements in both R&D and high-volume manufacturing (HVM) environments. The new XBS300 hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip).

XBS300 Hybrid

The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development. In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability. This makes the XB8 wafer bonder ideal for applications from the MEMS, advanced packaging, 3D integration and LED fields.

NP12

The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging.

XBS200

The BA8 Gen4 Pro bond alignment platform is designed for demanding processes in MEMS and LED production and advanced packaging markets. It accurately aligns substrates and secures their position in fixtures for further process steps. The bond alignment of two wafers is based on the same powerful technology that has proven its value with SUSS MicroTec’s mask aligners for mask to wafer alignment. The platform can be configured as a bond aligner only or as a combination of mask and bond aligner. A direct bonding toolkit offers  extra functionality for pre-bonding substrates. In order to enhance direct bonding processes, the BA8 Gen4 Pro can be equipped with an optional toolkit for selective and full-wafer surface activation. It can easily be upgraded with additional functions within a short time. The system handles substrates up to 200 mm in size. With its ergonomic  operation and intuitive user interface, the BA8 Gen4 Pro is easy to work with and requires only minimal operator training. Its high  degree of automation allows for easy operation and an application in labs, research and development as well as small series production.

BA8 Gen4 Pro

The Karl Suss BA 6 mask aligner can be used for processing of wafers from 2" to 150mm. The Karl Suss BA 6 is designed for all standard lithography applications and wafer sized up to 150mm. The Karl Suss BA 6 also offers high resolution and optimum edge quality for thick-resist MEMs applications, and features tailored to III-V compounds, thin or warped wafers, tranparent substrates, or single dies.

CB200

Semi-automated system up to 300 mm 
Excimer Laser-Assisted Debonding

ELD300

The SUSS SB6L is the ideal complement to the SUSS Bond Aligner. It is a universal tool for wafer bonding processes for micro electro-mechanical system applications such as: Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding (AB) (SFB), Thermal Compression Bonding (TCB) (ADB) After alignment on the Bond Aligner, the substrate stacks are mechanically clamped using the transport fixture for further processing in the Substrate Bonder. 

SUSS MicroTec / KARL SUSS

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Top SUSS MicroTec / KARL SUSS Bonders

SB6

CBC200

ABC200

CB200M

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