Description
AUTOMATED PRODUCTION WAFER BONDING SYSTEMConfiguration
No ConfigurationOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents
SUSS MicroTec / KARL SUSS
ABC200
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
41224
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllSUSS MicroTec / KARL SUSS
ABC200
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
41224
Wafer Sizes:
8"/200mm
Vintage:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
AUTOMATED PRODUCTION WAFER BONDING SYSTEMConfiguration
No ConfigurationOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents