Description
ALD (Atomic Layer Deposition)Configuration
No ConfigurationOEM Model Description
NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.Documents
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TEL / TOKYO ELECTRON
NT333
Verified
CATEGORY
ALD
Last Verified: 20 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106452
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
NT333
CATEGORY
ALD
Last Verified: 20 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106452
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ALD (Atomic Layer Deposition)Configuration
No ConfigurationOEM Model Description
NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.Documents
No documents