Description

UTC 2000 Wire bonder

Configuration

No Configuration

OEM Model Description

SHINKAWA UTC-2000 Super is an ultra-precise, fully automated wire bonder that is capable of producing up to 100 bonds per second with minimal handling time. It features integrated automated wire cleaning, alignment, vibration and thermal imaging systems for optimal efficiency and reliability.

Documents

No documents

SHINKAWA

UTC 2000 SUPER

Verified

Wire / Wedge / Ball Bonder

Last Verified: 11 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

149458

Wafer Sizes:

Unknown

Vintage:

2009

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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