Description
No descriptionConfiguration
No ConfigurationOEM Model Description
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.Documents
No documents
DISCO
DFP8141
Verified
CATEGORY
Wafer Polishing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112290
Wafer Sizes:
Unknown
Vintage:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFP8141
CATEGORY
Wafer Polishing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112290
Wafer Sizes:
Unknown
Vintage:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.Documents
No documents