DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DFG8761

2001
Dry polishing process developed; world's first dry polisher, DFDP8140, and dry polishing wheels released.

DFDP8140

The DISCO DFP8160 is a fully automatic dry polisher designed for stress relief on wafers up to 300 mm in diameter. It removes grinding-induced damage layers from wafer backsides without the use of slurry, chemicals, or water, thereby reducing wafer breakage and warpage while improving die strength and product yield. Additionally, its design allows integration with DISCO grinders, facilitating safer wafer handling in inline configurations. 

DFP8160

The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.

DGP8760

The DFP8140 is a fully automatic polisher made by DISCO Corporation. It is a dry polisher for Φ8-inch wafers with chemical-free stress relief. This dry polisher can remove the grinding damage layer on the backsides of wafers up to Φ8 inches without slurry. This process greatly reduces wafer breakage and warpage and improves die strength and product yield. The DFP8140 is designed to polish wafers of diameter Φ4/5/6/8 inch (select one size) using an anomalous in-feed grinding with wafer rotation method. It uses a Φ300 mm dry polishing wheel and a porous chuck table with vacuum chuck-method. The chuck table has a revolution speed range of 0-300 min-1 and is cleaned using water & air thrust up, leveling stone and brush cleaning. The spindle has an output of 4.8 kW and a revolution speed range of 1,000-4,000 min-1. The machine dimensions are 1,200 × 2,670 × 1,800 mm (W×D×H) and it weighs approximately 1,900 kg.

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DFG8761

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