Description
Weight: Grinding area section 5200 LBS = 2’358 kg Handling area section 2300 LBS = 1’043 kg Total weight 7500 LBS = 3 401 kg Footprint: Length: 66 in. (1676.5 mm) Depth: 84 in. (2133.5 mm) Height: 76 in. (2032 mm) Work Height: 39 in. (990.5 mm)Configuration
No ConfigurationOEM Model Description
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "Documents
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Verified
CATEGORY
Wafer Grinding
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
149083
Wafer Sizes:
Unknown
Vintage:
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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STRASBAUGH
7AF
CATEGORY
Wafer Grinding
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
149083
Wafer Sizes:
Unknown
Vintage:
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Weight: Grinding area section 5200 LBS = 2’358 kg Handling area section 2300 LBS = 1’043 kg Total weight 7500 LBS = 3 401 kg Footprint: Length: 66 in. (1676.5 mm) Depth: 84 in. (2133.5 mm) Height: 76 in. (2032 mm) Work Height: 39 in. (990.5 mm)Configuration
No ConfigurationOEM Model Description
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "Documents
No documents