Description
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU boardConfiguration
No ConfigurationOEM Model Description
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.Documents
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OKAMOTO
GNX 300
CATEGORY
Wafer Grinding
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
143426
Wafer Sizes:
12"/300mm
Vintage:
2003
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU boardConfiguration
No ConfigurationOEM Model Description
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.Documents
No documents