 Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.

OKAMOTO

GNX 300

12" Wafer Back Grinder GNX-300
L*W*H (cm) -140x255x180  �Weight (kg) -� 6000
1. Can't support 12" wafer
2. Unable to operate in products with a thickness of less than 300um.
3.Hub Port
4. CPU board







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Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts maintenance services. 

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GNX 300

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GNX 300