Description
long (cm): 132, Width (cm): 72, High (cm): 162, Weight( KG): 270Configuration
Thinning machine (used)OEM Model Description
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.Documents
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DISCO
DFG840
CATEGORY
Wafer Grinding
Last Verified: 28 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
151109
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
long (cm): 132, Width (cm): 72, High (cm): 162, Weight( KG): 270Configuration
Thinning machine (used)OEM Model Description
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.Documents
No documents