Description
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Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEM Model Description
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.Documents
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Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
119962
Wafer Sizes:
6"/150mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DAG810
CATEGORY
Wafer Grinding
Last Verified: 29 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
119962
Wafer Sizes:
6"/150mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEM Model Description
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.Documents
No documents