Description

Buehler MPC 2000 Micro-Precise Cross-Sectioning Grinding System The Unit's Serial Number Tag Reads: Catalog Number: 49-3001-1260 Serial Number: 543-EGIC-121 Power Requirements: 100-115 VAC, 50-60 Hz, Single Phase, 15.00 A CE Marked: Yes Features: Cross-sectioning Grinding System for Micro-Electronic and Micro-Component Analysis Position accuracy of ±1 micron Variable Speed Platen: 1-50 rpm in 1 rpm increments 1 µm Digital Micrometer Adjustment Precision Lapped Stainless Steel Platen for Increased Accuracy Tri-Point Platen Support System for Increased Precision Variable Speed Oscillating Head Integrated Sink Main Description: Catalog 49-3001 MPC 2000 Integrated Circuit Cross-Sectioning System, tabletop unit, includes MPC 2000 Power Head complete with digital micrometer and oscillating motor mounting post with adjustable floating mount, 8" (203 mm) slow speed EcoMet Grinder-Polisher with 1-50 rpm in 1 rpm increments, variable speed range, aluminum alloy base casting with integral bowl and rinsing sink, bowl wash, flexible hose water supply, steel cabinet, precision ground drive plate, plumbed for DI water, dial indicator and mounting jig, precision lapped stainless-steel platen. Remote Digital Display Option: 60-5153 Remote Digital Display, includes digital display console with 3 ft. Adapter cord for connecting to digital micrometer. Tilt Alignment Microscope Option: 60-5152 Tilt Alignment Microscope Assembly, includes a 200x focusing microscope with an alignment cross-hair, light source, with power adapter, and locking swing-in/swing-out position mount.

Configuration

Specifications: System Configuration: 8" (203 mm) Precision Grinder/Polisher base with electricity driven head Head Oscillation: 22 cycles/minute Operating: Semi-Automatic Base Motor: 1 HP (746 watts) Platen Speeds: 1-50 rpm in 1 rpm increments Main Power: 84-264 VAC, 50/60 Hz, Single Phase (this is a 115 VAC system) Water: 1/4" (6.4 mm) O.D. Nylon supply tube from 40-100 psi (275-690 kPa) water source Weight: 200 lbs. (91 kg) Dimensions: 22-1/2" W x 28-1/8" D x 22-1/2" H (57.2 cm x 71.5 cm x 57.2 cm)

OEM Model Description

The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.