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MPC 2000
Category
Wafer GrindingOverview
The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.
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