Description
Grinding machineConfiguration
No ConfigurationOEM Model Description
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.Documents
No documents
Verified
CATEGORY
Wafer Grinding
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
153698
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TOSEI
W-GM-4200
CATEGORY
Wafer Grinding
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
153698
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Grinding machineConfiguration
No ConfigurationOEM Model Description
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.Documents
No documents