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W-GM-4200
Category
Wafer GrindingOverview
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.
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