DFG841
Category
Polishing and GrindingOverview
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
Active Listings
9
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Top Listings
- DFG841Polishing and GrindingVintage: Condition: UsedLast VerifiedOver 30 days ago
- DFG841Polishing and GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago
- DFG841Polishing and GrindingVintage: 2003Condition: UsedLast VerifiedOver 60 days ago
- DFG841Polishing and GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago
- DFG841Polishing and GrindingVintage: 2005Condition: UsedLast VerifiedOver 60 days ago
- DFG841Polishing and GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago
- DFG841Polishing and GrindingVintage: 1998Condition: UsedLast VerifiedOver 60 days ago
- DFG841Polishing and GrindingVintage: 2000Condition: RefurbishedLast VerifiedOver 60 days ago