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EVGroup (EVG) EVG810 LT
    Description
    Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding
    Configuration
    No Configuration
    OEM Model Description
    The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).
    Documents

    No documents

    EVGroup (EVG)

    EVG810 LT

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Bonders

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Deinstalled

    Product ID:

    98353

    Wafer Sizes:

    2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm

    Vintage:

    2009

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
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    EVGroup (EVG) EVG810 LT

    EVGroup (EVG)

    EVG810 LT

    Wafer Bonders
    Vintage: 2009Condition: Used
    Last VerifiedOver 60 days ago

    EVGroup (EVG)

    EVG810 LT

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Bonders
    Last Verified: Over 60 days ago
    listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/049cbe38cbbf4b17a9faa00b7e7574e9_14_mw.png
    listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/d89619547d164228bbae80bf56648269_13_mw.png
    listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/d1dd25c95d044e52a479c224c34d9aa1_12_mw.png
    listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/fb77b0d44e2346ea9816a95dd7674844_11_mw.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Deinstalled

    Product ID:

    98353

    Wafer Sizes:

    2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm

    Vintage:

    2009

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding
    Configuration
    No Configuration
    OEM Model Description
    The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).
    Documents

    No documents

    Similar Listings
    View All
    EVGroup (EVG) EVG810 LT

    EVGroup (EVG)

    EVG810 LT

    Wafer BondersVintage: 2009Condition: UsedLast Verified:Over 60 days ago