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EVGroup (EVG) EVG810 LT
  • EVGroup (EVG) EVG810 LT
  • EVGroup (EVG) EVG810 LT
  • EVGroup (EVG) EVG810 LT
  • EVGroup (EVG) EVG810 LT
Description
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding
Configuration
No Configuration
OEM Model Description
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).
Documents

No documents

EVGroup (EVG)

EVG810 LT

verified-listing-icon

Verified

CATEGORY
Wafer Bonders

Last Verified: Over 60 days ago

Key Item Details
Condition:

Used

Operational Status:

Deinstalled

Product ID:

98353

Wafer Sizes:

2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm

Vintage:

2009

Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
EVGroup (EVG) EVG810 LT

EVGroup (EVG)

EVG810 LT

Wafer Bonders
Vintage: 2009Condition: Used
Last VerifiedOver 60 days ago

EVGroup (EVG)

EVG810 LT

verified-listing-icon
Verified
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/049cbe38cbbf4b17a9faa00b7e7574e9_14_mw.png
listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/d89619547d164228bbae80bf56648269_13_mw.png
listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/d1dd25c95d044e52a479c224c34d9aa1_12_mw.png
listing-photo-c033adb0df7245d698191bd7a08f4690-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1515/c033adb0df7245d698191bd7a08f4690/fb77b0d44e2346ea9816a95dd7674844_11_mw.png
Key Item Details
Condition:

Used

Operational Status:

Deinstalled

Product ID:

98353

Wafer Sizes:

2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm

Vintage:

2009

Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Low Temp. Plasma Activation System for wafer bonding Maker: EVG (EVGroup) Model: EVG 810 LT Type: Manual Type EQP. Size(W*L*H): 1520*1210*1530 (mm) Wafer Size: 50 ~ 200mm Process : Silicon, Glass, GaAs, Etc Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding
Configuration
No Configuration
OEM Model Description
The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).
Documents

No documents

Similar Listings
View All
EVGroup (EVG) EVG810 LT

EVGroup (EVG)

EVG810 LT

Wafer BondersVintage: 2009Condition: UsedLast Verified:Over 60 days ago