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Description
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Fusion Bonding System with Megasonic Cleaner, Plasma Activation, Flat Finder, IR Camera and Bond Chamber,OEM Model Description
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer BonderDocuments
No documents
Verified
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
120049
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 LT
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
120049
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Fusion Bonding System with Megasonic Cleaner, Plasma Activation, Flat Finder, IR Camera and Bond Chamber,OEM Model Description
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer BonderDocuments
No documents