Description
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mmConfiguration
No ConfigurationOEM Model Description
Wafer BonderDocuments
No documents
EVGroup (EVG)
EVG520
Verified
CATEGORY
Wafer Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105029
Wafer Sizes:
Unknown
Vintage:
Unknown
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Refurbishment Services
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EVGroup (EVG)
EVG520
CATEGORY
Wafer Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105029
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mmConfiguration
No ConfigurationOEM Model Description
Wafer BonderDocuments
No documents