Description

Description FUSION 150/3D Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Power Requirements 380 V 14.0 A 50 Hz 3 Phase

Configuration

No Configuration

OEM Model Description

The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.

Documents

No documents

AXCELIS / FUSION

200 PCU

Verified

UV-Curing

Last Verified: Today

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

121204

Wafer Sizes:

6"/150mm, 8"/200mm

Vintage:

1996

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

Similar Listings