Description

Description FUSION 150/7D Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Power Requirements Other V 12.0 A 50 Hz 3 Phase

Configuration

No Configuration

OEM Model Description

The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.

Documents

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AXCELIS / FUSION

200 PCU

Verified

UV-Curing

Last Verified: Today

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

121206

Wafer Sizes:

6"/150mm, 8"/200mm

Vintage:

1995

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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