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KLA / ADE ULTRASCAN 9600
    Description
    Supported SEMI/JEIDA Geometries Wafer diameters supported: 125mm, 150mm, 200mm (polished or patterned) Wafer thickness: 400 um to 800 um Notches, Flats(primary/Secondary): Up to four(4) per SEMI and JEIDA standards Edge Exclusion: To 3 mm from edge (2mm optional) Measurement and sorting Thickness Center point, Five point, Full wafer scan Shape: Bow, Warp, using 3-point & Best-fit references Global Flatness: SEMI GBI ,TIR, FPD, FPD%, 5-point TTV Site Flatness: All SEMI M1 Standards with 8 – 30mm sit size and variable site offsets Data Density and Throughput Number of thickness/shape data points: Up to 17300 points Throughput using optional handler: 30 – 59+ wafer/hour ( depends on wafer size, measurement pattern and mode System Consist of: System Consist of: Cassette input stations*2 Cassette output stations*3 Pal station *1 E-plus station *1 Rest station*1 ASC Controller*1 ADE single robot station*1 ADE robot controller*1 Main DC power*1 Delivery time: 4 months Option Choice upgrade tools Controller function open (edge 2mm) Signal effector arm Robot upgrade to Duel effector arm robot ASC Controller upgrade to ASC 2000 UPS(C-10000F) Non-contact P/N Type tester: For wafer resistivity from 0.1 to 200ohm-cm
    Configuration
    No Configuration
    OEM Model Description
    UltraScan Wafer Metrology System The 9600 and 9650 systems, introduced in 1994 and based on the more advanced E-Plus station, measure thickness down to an accuracy of 0.25 microns.
    Documents
    verified-listing-icon

    Verified

    CATEGORY
    Thin Film / Film Thickness

    Last Verified: Over 30 days ago

    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    150818


    Wafer Sizes:

    5"/125mm, 6"/150mm, 8"/200mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    KLA / ADE ULTRASCAN 9600

    KLA / ADE

    ULTRASCAN 9600

    Thin Film / Film Thickness
    Vintage: 0Condition: Refurbished
    Last VerifiedOver 30 days ago

    KLA / ADE

    ULTRASCAN 9600

    verified-listing-icon
    Verified
    CATEGORY
    Thin Film / Film Thickness
    Last Verified: Over 30 days ago
    listing-photo-e209783b97de45deafe196757cce883d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50682/e209783b97de45deafe196757cce883d/17847801cac44b518ddf4359d12085f8_ade960013_f.jpg
    listing-photo-e209783b97de45deafe196757cce883d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50682/e209783b97de45deafe196757cce883d/b019fe96a3d04b44b5cb3e917ad3938b_ade960012_f.jpg
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    listing-photo-e209783b97de45deafe196757cce883d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50682/e209783b97de45deafe196757cce883d/a1f92da8178740d5b313c2334cc5c9b7_ade96009_f.jpg
    listing-photo-e209783b97de45deafe196757cce883d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50682/e209783b97de45deafe196757cce883d/96a16d0c94774463878e3cd830877c98_ade96008_f.jpg
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    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    150818


    Wafer Sizes:

    5"/125mm, 6"/150mm, 8"/200mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Supported SEMI/JEIDA Geometries Wafer diameters supported: 125mm, 150mm, 200mm (polished or patterned) Wafer thickness: 400 um to 800 um Notches, Flats(primary/Secondary): Up to four(4) per SEMI and JEIDA standards Edge Exclusion: To 3 mm from edge (2mm optional) Measurement and sorting Thickness Center point, Five point, Full wafer scan Shape: Bow, Warp, using 3-point & Best-fit references Global Flatness: SEMI GBI ,TIR, FPD, FPD%, 5-point TTV Site Flatness: All SEMI M1 Standards with 8 – 30mm sit size and variable site offsets Data Density and Throughput Number of thickness/shape data points: Up to 17300 points Throughput using optional handler: 30 – 59+ wafer/hour ( depends on wafer size, measurement pattern and mode System Consist of: System Consist of: Cassette input stations*2 Cassette output stations*3 Pal station *1 E-plus station *1 Rest station*1 ASC Controller*1 ADE single robot station*1 ADE robot controller*1 Main DC power*1 Delivery time: 4 months Option Choice upgrade tools Controller function open (edge 2mm) Signal effector arm Robot upgrade to Duel effector arm robot ASC Controller upgrade to ASC 2000 UPS(C-10000F) Non-contact P/N Type tester: For wafer resistivity from 0.1 to 200ohm-cm
    Configuration
    No Configuration
    OEM Model Description
    UltraScan Wafer Metrology System The 9600 and 9650 systems, introduced in 1994 and based on the more advanced E-Plus station, measure thickness down to an accuracy of 0.25 microns.
    Documents
    Similar Listings
    View All
    KLA / ADE ULTRASCAN 9600

    KLA / ADE

    ULTRASCAN 9600

    Thin Film / Film ThicknessVintage: 0Condition: RefurbishedLast Verified:Over 30 days ago
    KLA / ADE ULTRASCAN 9600

    KLA / ADE

    ULTRASCAN 9600

    Thin Film / Film ThicknessVintage: 0Condition: UsedLast Verified:12 days ago