KLA-Tencor Corp. announced it has completed its acquisition of ADE Corp., a supplier of silicon wafer metrology and related gear.

UltraScan Wafer Metrology System
The 9600 and 9650 systems, introduced in 1994 and based on the more advanced E-Plus station, measure thickness down to an accuracy of 0.25 microns. 

KLA / ADE

ULTRASCAN 9600

The AFS-300 series systems operate in a class 10 cleanroom, utilizing ADE's E-Plus station for precision. They measure wafer properties with high accuracy (0.25 microns), including thickness, flatness, shape, conductivity, and resistivity. Integration with factory automation is seamless through standard protocols.

AFS-300

The EpiScan 1000 series of products are high speed film thickness measurement and mapping tools designed specifically for leading edge characterization measurements of advanced thin epi.

EPISCAN 1000

3910

Low Cost Thickness, Shape and Global Flatness Measurement System. Measures 8,700 data points in under 60 seconds. Thickness measurements from 250µm to 750µm. Shape measurements to 1,100µm. Patterned, polished or taped wafer surfaces. Expandable and upgradable.

 ULTRAGAGE  9520

The EpiScan 9900 series of products are benchtop metrology systems containing a single measurement module, which is capable of making selected measurements, including Epi thickness, thickness variation and dopant profile. The EpiScan 9900 system, introduced in 1997, is based on advanced, model-based FTIR (Fourier Transform Infrared Spectroscopy) technology licensed to the Company by On-Line Technologies, Inc. The  EpiScan 9900 system is capable of being operated in a class 10 cleanroom environment.

EPISCAN 9900

The UltraScan 9000 series of products are high throughput, in-line production systems that perform metrology and sorting at various stages of the wafer manufacturing and device fabrication processes. The 9300 and 9350 systems, introduced in 1990, employ the Company's E station measurement module to measure thickness down to an accuracy of 0.5 microns. The 9350 and 9650 systems have a smaller footprint than their larger counterparts, making them more suitable for applications in the device fabrication process, including photolithography, thermal processing, CMP and thin film deposition.

ULTRASCAN 9350

ULTRASCAN 8300

The 9530-NT applies ADE's industry-standard metrology to backgrind, etch and lap processes that reduce wafer thickness to as little as 150 microns. It is designed for production operations that demand high-performance metrology for equipment setup, process qualification and ongoing process control of next-generation wafer-thinning processes. The 9530-NT measures wafers as thin as 150 micron while keeping wafers safely centered within its dynamic measurement range.

ULTRAGAGE 9530-NT

The 9505-NT UltraGage characterizes thin-film stress and wafer shape for both patterned and monitor wafers. It provides fast, high-resolution measurements in two dimensions, and it correlates with x-ray diffraction, which is the only direct measure of thin film stress. It is not sensitive to film type, reflectivity or other optical reflections that may result from subsurface multi-layer stacks. An off-line software package enables the 9505-NT to measure both local and global stress.

ULTRAGAGE 9505-NT

The 9600 and 9650 systems, introduced in 1994 and based on the more advanced E-Plus station, measure thickness down to an accuracy of 0.25 microns.The 9350 and 9650 systems have a smaller footprint than their larger counterparts, making them more suitable for applications in the device fabrication process, including photolithography, thermal processing, CMP and thin film deposition.

ULTRASCAN 9650

The Autogager 1500, the first large-scale, automated dimensional metrology system for the hard disk market, was introduced by These systems measure thickness and thickness variation on advanced hard disks and provide high speed sorting. The products combine an industrial robot with the company's capacitive dimensional metrology into a single, floor-mounted system. These systems, which are capable of operating in a class 1000 cleanroom environment, provide a non-destructive in-line sorting capability and precise disk classification at submicron accuracies.

AUTOGAGER 1500

Wafer flatness measurements to 90nm line widths, 200mm/300mm, SOI and bare wafer capability. Measures thickness of wafers by electrical capacitance.

AFS-3220 FA

AFS 3220, utilize high voltage fast differential charge amplifiers with low noise DAC oscillator, 375 KHz synchronized DC/DC converter power supplies, antialising filter and ADC. The 3220 AFS system is the company's latest in a line of non contact capacitance-based wafer geometry measurement systems.

AFS-3220

The ADE 9500 UltraGage is a benchmark in wafer geometry characterization, essential in device fabrication and silicon wafer manufacturing. It accurately measures thickness, flatness, bow/warp, and more, using noncontact methods with 10nm resolution, applicable to both patterned and polished wafers. This compact tool offers nondestructive control, with options for manual or cassette operation, and supports optional networking including SECS/GEM. Ideal for applications in photolithography, CMP, and other processes, the UltraGage is a versatile, high-performance metrology solution.

ULTRAGAGE 9500

The UltraScan 9000 series of products are high throughput, in-line production systems that perform metrology and sorting at various stages of the wafer manufacturing and device fabrication processes. The 9300 and 9350 systems, introduced in 1990, employ the Company's E station measurement module to measure thickness down to an accuracy of 0.5 microns.

ULTRASCAN 9300

The UltraGage 9700 system, introduced in 1995, is based on the E-Plus station measurement module. The UltraGage 9000 systems are capable of being operated in a class 10 cleanroom environment. These systems were designed to operate together with applications software to be used by device manufacturers in applications such as chemical mechanical planarization ("CMP") and thermal processing.

KLA / ADE

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Top KLA / ADE Thin Film / Film Thickness

AUTOGAGER 1500

ULTRAGAGE 9520

ULTRASCAN 8300

3910

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