Overview

The 9530-NT applies ADE's industry-standard metrology to backgrind, etch and lap processes that reduce wafer thickness to as little as 150 microns. It is designed for production operations that demand high-performance metrology for equipment setup, process qualification and ongoing process control of next-generation wafer-thinning processes. The 9530-NT measures wafers as thin as 150 micron while keeping wafers safely centered within its dynamic measurement range.