Description

No description

Configuration

CHA Industries Mark 50 Isolated Source E-Beam Evaporator System 120-208V, 60Hz CTI Cryogenics Cryo-Torr 400 cryopump 2ea Granville-Phillips 307 vacuum gauge controllers Inficon IC6 deposition controller Telemark ST/SX controller Telemax 135-0700-1 programmable sweep controller Beam gun rotation controller Deposition controller Shutter controller Fixture controller Auto ion gun controller Heater power supply Trillium 2200 cryopump controller Cryocoil controller CHA HVPS-T-18373 / Telemark SX-10 power supply, 208V, 60Hz Busch BA 0100 A dry vacuum pump CTI Cryogenics 9600 compressor Domes for both 6" and 8" substrates.

OEM Model Description

The CHA Mark 50 is an industry-standard high vacuum deposition system known for its simplicity, ease of operation, and unmatched reliability, making it an excellent choice for a wide range of applications. The system features a horizontal 32" by 32" water-cooled cylindrical chamber, facilitating easy loading and unloading. Its unique slide-down front door minimizes floor space requirements, and a rear door provides convenient access to the chamber from behind, allowing for through-the-wall mounting. The Mark 50 is SECS/GEM and CE compliant, ensuring compatibility with modern manufacturing standards. It offers dual operation capabilities for sputtering and evaporation, accommodates moving substrates, and provides exceptional film uniformity (fixture dependent). The system supports up to 4 process stations with round cathodes (RF or DC) and co-deposition capability. Additionally, it includes bias (RF or DC), substrate heating up to 400°C with multi-element options, electron beam, thermal deposition, ion beam pre-clean/etch, and plasma texturing/etch functionalities. -Dual Operation, Sputtering and Evaporation -Moving substrates -Exceptional Film Uniformity (Fixture Dependent) -Sputter Up -Process Stations -Round Cathodes, RF or DC (Up to 4 Stations) -Co-deposit -Bias, RF or DC -Substrate heating, 400°C, multi-element -Substrate heating, station -Electron beam -Thermal -Ion beam pre-clean/etch -Plasma texturing/etch