Description
Missing parts: NSO Kit, XP Robot with Enhanced High Temp Wrists and Shipping Case (XP Robot *2) Robot Wrist CIP v2.3 (XP Robot *4) Blade, Ceramic Open Pocket Conductive (ACB Blade *4) Spec., LM DARP Edge Grip End Effector KI (FI Robot Blade) NSK Driver, Two-Axis Servo, 110 Vac AC F47 (NSK Driver *4) Assembly, Transfer Intlk w/ Pos 5 300mm MF Buffer Interlock PCB Assy. PCB, CDN391R, D-I/O, 300mm Endura Assy, PCB, CDN396R, A-I/O, 300mm Endura *2 PVD Dual Chamber Degas 208V Heater Driver (Degas Heat Driver) PVD 208V Dual Swill Lamp Degas Driver (Degas Lamp Driver) On-Board IS Controller (IS200V Compatible) Remote/Pump Right Mount (IS Controller) Cyro Compressor, 208V AC MIT-Ready 300mm Endura 2 *2Configuration
Copper PVDOEM Model Description
The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.Documents
No documents
APPLIED MATERIALS (AMAT)
ENDURA II
Verified
CATEGORY
PVD / Sputtering
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
50325
Wafer Sizes:
12"/300mm
Vintage:
2015
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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View AllAPPLIED MATERIALS (AMAT)
ENDURA II
Verified
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
50325
Wafer Sizes:
12"/300mm
Vintage:
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Missing parts: NSO Kit, XP Robot with Enhanced High Temp Wrists and Shipping Case (XP Robot *2) Robot Wrist CIP v2.3 (XP Robot *4) Blade, Ceramic Open Pocket Conductive (ACB Blade *4) Spec., LM DARP Edge Grip End Effector KI (FI Robot Blade) NSK Driver, Two-Axis Servo, 110 Vac AC F47 (NSK Driver *4) Assembly, Transfer Intlk w/ Pos 5 300mm MF Buffer Interlock PCB Assy. PCB, CDN391R, D-I/O, 300mm Endura Assy, PCB, CDN396R, A-I/O, 300mm Endura *2 PVD Dual Chamber Degas 208V Heater Driver (Degas Heat Driver) PVD 208V Dual Swill Lamp Degas Driver (Degas Lamp Driver) On-Board IS Controller (IS200V Compatible) Remote/Pump Right Mount (IS Controller) Cyro Compressor, 208V AC MIT-Ready 300mm Endura 2 *2Configuration
Copper PVDOEM Model Description
The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.Documents
No documents