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TEL / FSI MERCURY MP
  • TEL / FSI MERCURY MP
  • TEL / FSI MERCURY MP
  • TEL / FSI MERCURY MP
Description
Horizontal furnaces, GIGA TECH cleaning machines, and BAKE are excluded.
Configuration
No Configuration
OEM Model Description
The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.
Documents

No documents

CATEGORY
Spray Solvent / Acid

Last Verified: 4 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

124677


Wafer Sizes:

6"/150mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

TEL / FSI

MERCURY MP

verified-listing-icon
Verified
CATEGORY
Spray Solvent / Acid
Last Verified: 4 days ago
listing-photo-1c8de5efb1e54d51bbf98197cab347e2-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

124677


Wafer Sizes:

6"/150mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Horizontal furnaces, GIGA TECH cleaning machines, and BAKE are excluded.
Configuration
No Configuration
OEM Model Description
The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.
Documents

No documents