The Spray Acid Tool (SAT) is a versatile tool that offers a range of cleaning, etching, and stripping capabilities. It features a multichamber design that allows for safe and economical operation in a completely closed environment. The SAT is 300mm ready, meaning it can handle wafers of that size. Some of the specific applications of the SAT include post-CMP clean, photo-resist strip, polymer removal, pre-diffusion clean, monitor wafer clean, and metal etch. These processes are essential for the preparation and maintenance of semiconductor wafers during the manufacturing process.

Designed, developed & manufactured high performance and precision chemical processing equipment. Products included electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems.

SEMITOOL

The Spray Solvent Tool (SST) is a world standard in chemical stripping, developing, and cleaning technology. It has a multichamber capability and is 300mm ready. The SST can be used for a variety of processes, including developing, photoresist stripping, polymer removal, pre-metal deposition cleaning, and metal lift-off. This tool provides a versatile and efficient solution for a wide range of applications in the semiconductor industry.

The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.

FSI International, Inc. and YieldUP International Corporation announced that the two companies have entered into a definitive agreement for FSI to acquire YieldUP; YieldUP has also granted FSI a royalty-bearing license to its patent portfolio.

FSI International, Inc. was acquired by TEL and the new company profile is TEL FSI, Inc.

TEL / FSI

MERCURY MP

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance

The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

Spray Solvent / Acid

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Manufacturers of Spray Solvent / Acid

Top Products for Spray Solvent / Acid

SAT

SST

MERCURY MP

DCS1440