FSI International, Inc. and YieldUP International Corporation announced that the two companies have entered into a definitive agreement for FSI to acquire YieldUP; YieldUP has also granted FSI a royalty-bearing license to its patent portfolio.

FSI International, Inc. was acquired by TEL and the new company profile is TEL FSI, Inc.

The ZETA™ 200 is a fully automated system that can transfer wafer batches from incoming SMIF pods to the process chamber in a full mini-environment, ensuring minimal added particles. The system features the unique, high-temperature ViPR™ process for high-performance and low-cost stripping of resist, silicide, and other films. Batch spray processing provides a more economical alternative to single wafer resist strip solutions. The ZETA™ 200 can be configured with up to 8 different chemical inputs to a single, closed chamber, providing the flexibility to blend chemicals or change mix ratios and temperatures within a recipe. This system is also available in 300mm as the ZETA™ 300.

TEL / FSI

ZETA 200 

The ZETA Surface Conditioning System is a fully automated centrifugal spray processor designed for advanced, batch cleaning, etching and stripping applications on 200-mm and 300-mm wafers. The system is completely closed, providing greater process control and repeatability in an extremely clean environment. Compared to traditional wet cleaning technologies, the ZETA system uses less fab space and chemicals and operates at a much lower cost. It performs a variety of etching applications, including patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.

ZETA

CT200	

MERCURY OC

OMEGA 6200

SATURN MP

MERCURY+ includes a new, advanced control system that ensures that a proven technology, with over 1,000 systems installed worldwide, will continue to be a solution for years to come.

Supporting 75mm – 200mm wafers, the MERCURY+ addresses the industry’s need for a lower-cost batch spray solution. The new MERCURY control system includes replacements for obsolete components such as a new CPU, touchscreen interface, pneumatic card rack, input-output interface and motor speed controller. In addition, the new control system extends the system’s functionality with additional monitoring, data logging and maintenance functions, and is capable of running standard MERCURY processes without the need for requalification. 

MERCURY +

TITAN MP

SATURN OC

OMEGA 4000

ZETA 300 G3

The MERCURY® MP Surface Conditioning System is a wet-chemical batch processing tool for wafers up to 200 mm in diameter. It offers reliable and repeatable processing for a variety of applications, with the flexibility and control to ensure superior performance and high yields. The system can be fully automated with the addition of an optional material handling system. The MERCURY MP system uses FSI centrifugal spray technology, which provides several advantages, including reduced chemical, DI water, and disposal costs, as well as a smaller footprint than typical wet processing systems. Etching applications that can be performed in the MERCURY system include patterned aluminum etch/strip, wafer reclaim, oxide etch/strip, and polysilicon deglaze.

MERCURY MP

Mercury® Surface Conditioning Systems perform submicron cleaning, etching, and photoresist stripping applications. They are designed to help ensure that silicon wafers are free from contamination and ready for further processing.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

TEL / FSI

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Top TEL / FSI Spray Solvent / Acid

MERCURY +

ZETA 200

ZETA

TITAN MP

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