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The features of the NS300+ HT process module - renowned for its reliability and stability - have been carried on into the new NS300Z, a more productive scrubber. The system has an 8-process spin chamber and achieves a throughput of up to 1,000 wafers per hour (200% of the previous system). Unique function is also equipped to realize the prevention of contamination during wafer transport, while keeping high productivity. In addition, the Atomized Spray 2 (AS2) and brushes succeeding from the previous system was improved. The NS300Z provides a wide range of scrubber clean process with high productivity even in cutting-edge device manufacturing.

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