The superior reliability and stability of the NS300+ concept has been carried on into the new NS300+ HT. It is an improved, and more productive scrubber. As with the previous system, it is equipped with an 8 process spin chamber and achieves a throughput of up to 500 wafers per hour (a more than 150% increase compared with the previous system) with a footprint equivalent to that of the previous system.

TEL / TOKYO ELECTRON

NS300+ HT

NS300 is a 300mm wafer scrubber system which enables each side of wafer surface clean with high reliability and stability. Its Atomized Spray 2 (AS2) and bevel brushes deliver high quality cleaning process by reducing surface damage during process.

NS300

The SS-4 is a stand-alone wafer scrubber system developed by TEL. It is based on the Clean Track Mark 7 photoresist processing system and utilizes the Mark 7’s non-vacuum wafer handling capability. With TEL’s unique brushes and mechanical chuck, the SS-4 is capable of cleaning both sides of the wafer on a carrier-to-carrier basis, contributing remarkably to enhancing the megabit process yield. The SS-4 also offers the option to expand the variety of cleaning processes by combining the brush with a jet or Megasonic cleaning dispenser. Additionally, the SS-4 features TEL’s newest cleaning head, the hydraulic membrane head, which can be used with patterned, hydrophobic surfaces and even soft metal layers, expanding the applications for which scrubbers can be used.

Wafer size (mm): 300
Throughput (wph): 320
Process: DIW scrubber
Substrates: Si, Glass
Dry method: Spin, N2 blower
Nozzle type: AS2, Brush

NS300+

The features of the NS300+ HT process module - renowned for its reliability and stability - have been carried on into the new NS300Z, a more productive scrubber. The system has an 8-process spin chamber and achieves a throughput of up to 1,000 wafers per hour (200% of the previous system). Unique function is also equipped to realize the prevention of contamination during wafer transport, while keeping high productivity. In addition, the Atomized Spray 2 (AS2) and brushes succeeding from the previous system was improved. The NS300Z provides a wide range of scrubber clean process with high productivity even in cutting-edge device manufacturing.

TEL / TOKYO ELECTRON

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