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DISCO DFL7160
    Description
    WBL LASER SAW (DAF SAW) / working condition
    Configuration
    No Configuration
    OEM Model Description
    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.
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    DISCO

    DFL7160

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    23642


    Wafer Sizes:

    12"/300mm


    Vintage:

    2012

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    Logistics Support
    Available
    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
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    DISCO DFL7160
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    DISCO

    DFL7160

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
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    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    23642


    Wafer Sizes:

    12"/300mm


    Vintage:

    2012


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    WBL LASER SAW (DAF SAW) / working condition
    Configuration
    No Configuration
    OEM Model Description
    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.
    Documents

    No documents

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