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WAFER SAW MODULE: GRIND SPINDLE MAX REVOLUTION: 60. . 000 RPM. POWER: AC 200 V 3 PHASE.OEM Model Description
Disco DAD341 dicing saw can accommodate 200mm wafers and features an automatic theta rotation system. In addition to the new 1.0kW *Synchro SpindleTM, a new 2.2kW *Synchro SpindleTM is available as an option, widening the range of applications by raising the unit's ability to handle large workpieces and hard-to-cut materials.Documents
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DISCO
DAD341
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
111581
Wafer Sizes:
8"/200mm
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
WAFER SAW MODULE: GRIND SPINDLE MAX REVOLUTION: 60. . 000 RPM. POWER: AC 200 V 3 PHASE.OEM Model Description
Disco DAD341 dicing saw can accommodate 200mm wafers and features an automatic theta rotation system. In addition to the new 1.0kW *Synchro SpindleTM, a new 2.2kW *Synchro SpindleTM is available as an option, widening the range of applications by raising the unit's ability to handle large workpieces and hard-to-cut materials.Documents
No documents