Description
DISCO DAD341 Automatic Dicing Saw Manufacturer: DISCO Model: DAD341 Equipment Type: Automatic Dicing Saw Wafer Size: 8 inch (200 mm) Spindle Configuration: Single Spindle Spindle Power: 1.0 kW (Standard) / 2.2 kW (Optional) Spindle Speed: 6,000–60,000 rpm (1.0 kW) / 3,000–30,000 rpm (2.2 kW) Blade Size: 2 inch (Standard) / 3 inch (2.2 kW Option) X-axis Cutting Range: 326 mm Y-axis Cutting Range: 210 mm X-axis Speed: 0.1–400 mm/s Index Resolution: 0.0001 mm Z-axis Repeatability: 0.001 mm Theta-axis Rotation: 380 degrees Power Supply: 200 VAC, 3-phase Machine Dimensions: 863 × 1,235 × 1,235 mm Machine Weight: Approx. 900 kg Automatic dicing saw designed for precision cutting of silicon wafers and glass circuit boards. Manual workpiece loading and alignment required. Specifications may vary depending on the spindle configuration.Configuration
No ConfigurationOEM Model Description
Disco DAD341 dicing saw can accommodate 200mm wafers and features an automatic theta rotation system. In addition to the new 1.0kW *Synchro SpindleTM, a new 2.2kW *Synchro SpindleTM is available as an option, widening the range of applications by raising the unit's ability to handle large workpieces and hard-to-cut materials.Documents
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DISCO
DAD341
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
153642
Wafer Sizes:
Unknown
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DISCO DAD341 Automatic Dicing Saw Manufacturer: DISCO Model: DAD341 Equipment Type: Automatic Dicing Saw Wafer Size: 8 inch (200 mm) Spindle Configuration: Single Spindle Spindle Power: 1.0 kW (Standard) / 2.2 kW (Optional) Spindle Speed: 6,000–60,000 rpm (1.0 kW) / 3,000–30,000 rpm (2.2 kW) Blade Size: 2 inch (Standard) / 3 inch (2.2 kW Option) X-axis Cutting Range: 326 mm Y-axis Cutting Range: 210 mm X-axis Speed: 0.1–400 mm/s Index Resolution: 0.0001 mm Z-axis Repeatability: 0.001 mm Theta-axis Rotation: 380 degrees Power Supply: 200 VAC, 3-phase Machine Dimensions: 863 × 1,235 × 1,235 mm Machine Weight: Approx. 900 kg Automatic dicing saw designed for precision cutting of silicon wafers and glass circuit boards. Manual workpiece loading and alignment required. Specifications may vary depending on the spindle configuration.Configuration
No ConfigurationOEM Model Description
Disco DAD341 dicing saw can accommodate 200mm wafers and features an automatic theta rotation system. In addition to the new 1.0kW *Synchro SpindleTM, a new 2.2kW *Synchro SpindleTM is available as an option, widening the range of applications by raising the unit's ability to handle large workpieces and hard-to-cut materials.Documents
No documents