Description
Wafer Dicing SawConfiguration
No ConfigurationOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
No documents
DISCO
DAD3350
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
72605
Wafer Sizes:
8"/200mm
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DAD3350
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
72605
Wafer Sizes:
8"/200mm
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer Dicing SawConfiguration
No ConfigurationOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
No documents